My activities in May:

In May I had a pleasure to take the QEM 2013 curse. The workshop was held during two weeks, from Monday 13th to Friday 24th of May 2013.Place was extraordinary - Saint-Aygulf, on the French riviera. This school was devoted to advanced electron microscopy users. The lectures provided an exhaustive overview of up-to-date TEM techniques including mapping of elementals, strains and electromagnetic fields, four dimensions microscopies, and timely instrumental developments.

During last month I got another trial version of Lumerical FDTD Solution software.
Main objective was to investigate scattering and absorption cross sections of silver nanoparticles as well as near field distribution. 2 D simulations gave right results for small particles. But for bigger particles >100nm results was not simmilar to those from literature.

The sotware tool which allows to view the near field distribution around the nanoparticles was succesfully used. For the future this option ca ce used for plasmmonic resonaces determination.

Viscosity study of the binary metallic systems have been performed. Three different approaches were used for modelling of the dynamic properties.
The first one was non-equlibrium MD (NEMD) simulation method, the second a reverse non-equilibrium MD simulation method and the third method is based on the Green-Kubo (GK) relation.

I participatied in the Symposium 'Materials Science for industry' held in 11-13.04.2013 in Krynica-Zdroj. As other PhD students, I gave presentation with the title 'Influence of zirconium and scandium on microstructural and textural changes of severely deformed aluminum alloys'.
I was working the the transition of data obtained with EBSD/SEM for the cross-section ND-TD and TD-ND into rolling ED-TD.

This month examination of carrier lifetime was performed. In addition I have changed the type of base material (monocrystalline silicon) and the way of surface passivation. For these measurements chemical passivation of silicon in 0.07M QM was used. Such treatment passivates the surface after 20 minutes and keep it secure for about one hour.
In addition, I took up spots on the silicon surface after alkaline texturization. Not using bleach but long soak get rid them. Recipe of silicon cleaning using in electronics worked well.